To enhance semiconductor efficiency. it is imperative to develop a die-bonding material possessing exceptional thermal conductivity and stress-shielding capabilities to safeguard semiconductor components from detrimental heat and destructive stress. In this study. we employed a multi-objective topology optimization approach to design a porous microstructure for the die-bonding layer o... https://safeersappliancers.shop/product-category/liebherr-cuel2831-55cm-fridge-freezer-silver-265-litres-a/